FermionIC Design

Unified beamformer-plus-front-end-module IC solution across the RF signal chain, unlike competitors' point parts.

Beamformer chips that skip the pre-power amplifier, cutting component count, cost and space.

Ambition to design RF chips domestically in India while serving global communication/RF chip demand.

ICs sold as core components for radars built by large system integrators (B2B model).

Parts listed on India's Government e-Marketplace (GeM); government-organization customers procure through this portal.

X-band (8-12 GHz) chips serving demand from satellite communication, maritime surveillance and weather-forecasting applications.

Direct government-procurement channel where FermionIC's parts are listed.

Plans to distribute parts in other geographies (e.g. US, Australia, EMEA) via strategic partnerships rather than direct sales.

Design of SERDES IP and hybrid beamformer ICs for high-speed wireline and RF communication.

Founding team with a cumulative century-plus of experience across major semiconductor/tech companies.

Manufacturing partner for FermionIC's GaN-based RF chips.

OSAT (outsourced semiconductor assembly and testing) partner for testing and packaging.

Revenue from chip purchase orders expected once fully in place by end of FY25, with generation targeted for the following fiscal year.