India’s Ministry of Electronics & IT (MeitY), through the Anusandhan National Research Foundation (ANRF), is preparing to fund R&D initiatives on two-dimensional (2D) semiconductor materials like graphene and TMDs. The goal: to enable angstrom-scale chips that could be up to ten times smaller than today’s most advanced silicon chips
🚀 Key Highlights
- Research funding imminent: MeitY plans to issue Expressions of Interest (EoIs) to select academic and industrial partners for pilot projects in 2D material-based chip technologies
- IISc proposal in review: A group of 30 scientists from the Indian Institute of Science (IISc) submitted detailed project reports in April 2022 and October 2024. They seek ₹500 crore over 5 years to develop India’s own 2D semiconductor capabilities
- Global context: Worldwide, Europe has invested over $1 billion, and South Korea $300 million, in 2D semiconductor R&D. India wants to become an early mover in this emerging space
🎯 Why 2D Materials Matter
| Feature | Silicon Chips | 2D Material Chips |
|---|---|---|
| Thickness | Several nanometers | Few atoms (angstrom-scale) |
| Size & Density | ~3 nm node is current | Potentially 10× smaller |
| Power Efficiency | High leakage at scale | Potential for ultra-low power |
| Manufacturing Readiness | Mature fabs in place | Still in R&D globally; none commercial |
🏛️ Government & Industry Engagement
- ANRF funding: MeitY will co-invest with ANRF to seed 2D materials programs and avoid duplication of efforts
- Institutional backing: The project was supported by NITI Aayog in 2022 and has received continued interest from MeitY, DRDO, and the Department of Space
- EoI strategy: Future calls will assess readiness of both academia and industries. Funding decisions will be based on maturity and applications
🌍 Strategic and Economic Implications
- Post‑silicon future: As silicon technology approaches physical limits, 2D materials could enable chips with greater density and efficiency—essential for quantum computing, advanced AI, and defense tech
- Sovereign tech capabilities: Building domestic know‑how in 2D semiconductors reduces India’s reliance on foreign wafer fabs and supports long‑term technological sovereignty
- Global competitiveness: India enters a research race with China, the US, EU, Japan, South Korea—and aims to stake early claim in a frontier area financialexpress
🔭 Next Steps & Watchpoints
- EoI Announcement: MeitY’s releases later this year will reveal project partners and areas of focus.
- Funding decisions: Selection based on project maturity, relevance, and ecosystem readiness.
- Pilot development: Early prototypes and fab trials in R&D cleanrooms.
- Tech scaling: Transitioning from lab-scale chips to pre-commercial demonstrators post-2026.
✅ Bottom Line
India’s strategic push to develop 2D material-based angstrom-scale chips marks its entry into the post‑silicon era of computing. With government-backed funding rounds, strong institutional proposals from IISc, and global interest accelerating, India is positioning itself for leadership in next‑gen semiconductor innovation.
